Patent Assignment Details
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Reel/Frame: | 036250/0885 | |
| Pages: | 3 |
| | Recorded: | 08/04/2015 | | |
Attorney Dkt #: | 14TPY0598US01/851663.601 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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11/22/2016
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Application #:
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14817502
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Filing Dt:
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08/04/2015
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Publication #:
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Pub Dt:
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06/30/2016
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Title:
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SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
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Assignee
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28 ANG MO KIO INDUSTRIAL PARK 2 |
SINGAPORE, SINGAPORE 569508 |
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Correspondence name and address
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SEED IP LAW GROUP PLLC
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701 FIFTH AVE, STE 5400
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SEATTLE, WA 98104
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