Patent Assignment Details
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Reel/Frame: | 015874/0887 | |
| Pages: | 3 |
| | Recorded: | 10/06/2004 | | |
Attorney Dkt #: | 25611-000101/US |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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03/18/2008
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Application #:
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10958392
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Filing Dt:
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10/06/2004
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Publication #:
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Pub Dt:
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09/15/2005
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Title:
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SEMICONDUCTOR MODULE WITH HEAT SINK AND METHOD THEREOF
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Assignee
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416, MAETAN-DONG, YEONGTONG-GU |
SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF |
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Correspondence name and address
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HARNESS, DICKEY & PIERCE, P.L.C.
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JOHN A. CASTELLANO
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P.O. BOX 8910
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RESTON, VA 20195
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