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Patent Assignment Details
NOTE:Results display only for issued patents and published applications. For pending or abandoned applications please consult USPTO staff.

Reel/Frame:022309/0887   Pages: 5
Recorded: 02/26/2009
Attorney Dkt #:105701-0001
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 12
1
Patent #:
Issue Dt:
08/17/1993
Application #:
07883583
Filing Dt:
05/12/1992
Title:
ALIGNED WAFER BONDING
2
Patent #:
Issue Dt:
03/15/1994
Application #:
07903830
Filing Dt:
06/23/1992
Title:
DIGITAL PRESSURE SWITCH AND METHOD OF FABRICATION
3
Patent #:
Issue Dt:
04/02/1996
Application #:
08255829
Filing Dt:
06/08/1994
Title:
NITROGEN BASED LOW TEMPERATURE DIRECT BONDING
4
Patent #:
Issue Dt:
02/12/2002
Application #:
09476456
Filing Dt:
12/30/1999
Title:
TRANSPOSED SPLIT OF ION CUT MATERIALS
5
Patent #:
Issue Dt:
06/13/2006
Application #:
10033715
Filing Dt:
12/28/2001
Title:
LIGHT EMISSION FROM SEMICONDUCTOR INTEGRATED CIRCUITS
6
Patent #:
Issue Dt:
11/02/2004
Application #:
10051623
Filing Dt:
01/17/2002
Publication #:
Pub Dt:
06/17/2004
Title:
TRANSPOSED SPLIT OF ION CUT MATERIALS
7
Patent #:
Issue Dt:
08/22/2006
Application #:
10431635
Filing Dt:
05/05/2003
Title:
SMOOTH THIN FILM LAYERS PRODUCED BY LOW TEMPERATURE HYDROGEN ION CUT
8
Patent #:
NONE
Issue Dt:
Application #:
10763578
Filing Dt:
01/21/2004
Publication #:
Pub Dt:
11/18/2004
Title:
Structures, materials and methods for fabrication of nanostructures by transposed split of ion cut materials
9
Patent #:
NONE
Issue Dt:
Application #:
10946583
Filing Dt:
09/20/2004
Publication #:
Pub Dt:
06/09/2005
Title:
Transposed split of ion cut materials
10
Patent #:
NONE
Issue Dt:
Application #:
11356717
Filing Dt:
02/17/2006
Publication #:
Pub Dt:
10/05/2006
Title:
Methods and structures to form precisely aligned stacks of 3-dimensional stacks with high resolution vertical interconnect
11
Patent #:
NONE
Issue Dt:
Application #:
11377926
Filing Dt:
03/15/2006
Publication #:
Pub Dt:
10/26/2006
Title:
Light emission from semiconductor integrated circuits
12
Patent #:
Issue Dt:
09/08/2009
Application #:
11481238
Filing Dt:
07/03/2006
Publication #:
Pub Dt:
01/25/2007
Title:
LIGHT EMISSION FROM SEMICONDUCTOR INTEGRATED CIRCUITS
Assignor
1
Exec Dt:
12/21/2008
Assignee
1
590 TERRITORIAL DRIVE, UNIT B
BOLINGBROOK, ILLINOIS 60440
Correspondence name and address
CHRISTOPHER NATKANSKI, ESQ. ROPES & GRAY
ONE INTERNATIONAL PLACE
BOSTON, MA 02110

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