Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
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Reel/Frame: | 022309/0887 | |
| Pages: | 5 |
| | Recorded: | 02/26/2009 | | |
Attorney Dkt #: | 105701-0001 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
12
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Patent #:
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Issue Dt:
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08/17/1993
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Application #:
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07883583
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Filing Dt:
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05/12/1992
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Title:
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ALIGNED WAFER BONDING
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Patent #:
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Issue Dt:
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03/15/1994
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Application #:
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07903830
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Filing Dt:
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06/23/1992
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Title:
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DIGITAL PRESSURE SWITCH AND METHOD OF FABRICATION
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Patent #:
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Issue Dt:
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04/02/1996
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Application #:
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08255829
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Filing Dt:
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06/08/1994
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Title:
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NITROGEN BASED LOW TEMPERATURE DIRECT BONDING
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Patent #:
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Issue Dt:
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02/12/2002
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Application #:
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09476456
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Filing Dt:
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12/30/1999
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Title:
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TRANSPOSED SPLIT OF ION CUT MATERIALS
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Patent #:
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Issue Dt:
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06/13/2006
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Application #:
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10033715
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Filing Dt:
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12/28/2001
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Title:
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LIGHT EMISSION FROM SEMICONDUCTOR INTEGRATED CIRCUITS
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Patent #:
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Issue Dt:
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11/02/2004
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Application #:
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10051623
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Filing Dt:
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01/17/2002
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Publication #:
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Pub Dt:
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06/17/2004
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Title:
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TRANSPOSED SPLIT OF ION CUT MATERIALS
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Patent #:
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Issue Dt:
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08/22/2006
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Application #:
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10431635
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Filing Dt:
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05/05/2003
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Title:
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SMOOTH THIN FILM LAYERS PRODUCED BY LOW TEMPERATURE HYDROGEN ION CUT
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10763578
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Filing Dt:
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01/21/2004
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Publication #:
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Pub Dt:
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11/18/2004
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Title:
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Structures, materials and methods for fabrication of nanostructures by transposed split of ion cut materials
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10946583
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Filing Dt:
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09/20/2004
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Publication #:
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Pub Dt:
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06/09/2005
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Title:
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Transposed split of ion cut materials
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11356717
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Filing Dt:
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02/17/2006
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Publication #:
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Pub Dt:
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10/05/2006
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Title:
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Methods and structures to form precisely aligned stacks of 3-dimensional stacks with high resolution vertical interconnect
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11377926
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Filing Dt:
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03/15/2006
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Publication #:
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Pub Dt:
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10/26/2006
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Title:
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Light emission from semiconductor integrated circuits
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Patent #:
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Issue Dt:
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09/08/2009
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Application #:
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11481238
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Filing Dt:
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07/03/2006
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Publication #:
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Pub Dt:
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01/25/2007
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Title:
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LIGHT EMISSION FROM SEMICONDUCTOR INTEGRATED CIRCUITS
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Assignee
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590 TERRITORIAL DRIVE, UNIT B |
BOLINGBROOK, ILLINOIS 60440 |
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Correspondence name and address
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CHRISTOPHER NATKANSKI, ESQ. ROPES & GRAY
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ONE INTERNATIONAL PLACE
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BOSTON, MA 02110
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