Patent Assignment Details
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| Reel/Frame: | 054703/0887 | |
| Pages: | 5 |
| | Recorded: | 12/21/2020 | | |
| Attorney Dkt #: | 109P001384US |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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04/12/2022
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Application #:
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17128204
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Filing Dt:
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12/21/2020
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Title:
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IGBT MODULE WITH HEAT DISSIPATION STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
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Assignee
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| 10F., NO. 455, SEC. 2, WENHUA 3RD RD., |
| LINKOU DIST., |
| NEW TAIPEI CITY, TAIWAN 244 |
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Correspondence name and address
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LI & CAI INTELLECTUAL PROPERTY OFFICE
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9F, NO. 69, SEC. 2 DUNHUA S. RD
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DA''AN DISTRICT
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TAIPEI, 11106 TAIWAN
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06/01/2024 07:20 AM
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