Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Reel/Frame: | 019983/0892 | |
| Pages: | 3 |
| | Recorded: | 10/18/2007 | | |
Attorney Dkt #: | 9898-609 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
|
Total properties:
1
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
11874826
|
Filing Dt:
|
10/18/2007
|
Publication #:
|
|
Pub Dt:
|
04/24/2008
| | | | |
Title:
|
SEMICONDUCTOR PACKAGE PREVENTING WARPING AND WIRE SEVERING DEFECTS, AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE
|
|
Assignee
|
|
|
416 MAETAN-DONG, YEONGTONG-GU, SUWON-SI |
GYEONGGI-DO, KOREA, REPUBLIC OF |
|
Correspondence name and address
|
|
HOSOON LEE
|
|
210 SW MORRISON STREET
|
|
SUITE 400
|
|
PORTLAND, OR 97204
|
Search Results as of:
06/17/2024 09:04 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|