Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 061783/0892 | |
| Pages: | 4 |
| | Recorded: | 10/26/2022 | | |
| Attorney Dkt #: | HCS |
| Conveyance: | CHANGE OF NAME (SEE DOCUMENT FOR DETAILS). |
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Total properties:
5
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Patent #:
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Issue Dt:
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03/29/2016
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Application #:
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14296796
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Filing Dt:
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06/05/2014
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Publication #:
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Pub Dt:
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12/11/2014
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Title:
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COPPER-ALLOY BARRIER LAYERS FOR METALLIZATION IN THIN-FILM TRANSISTORS AND FLAT PANEL DISPLAYS
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Patent #:
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Issue Dt:
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02/07/2023
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Application #:
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17399246
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Filing Dt:
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08/11/2021
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Publication #:
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Pub Dt:
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02/17/2022
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Title:
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DIFFUSION BARRIERS FOR METALLIC SUPERCONDUCTING WIRES
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Patent #:
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Issue Dt:
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03/07/2023
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Application #:
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17671768
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Filing Dt:
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02/15/2022
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Publication #:
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Pub Dt:
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07/14/2022
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Title:
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ELECTRONIC DEVICES HAVING BILAYER CAPPING LAYERS AND/OR BARRIER LAYERS
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Patent #:
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Issue Dt:
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05/02/2023
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Application #:
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17838476
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Filing Dt:
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06/13/2022
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Publication #:
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Pub Dt:
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09/29/2022
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Title:
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COPPER-ALLOY CAPPING LAYERS FOR METALLIZATION IN TOUCH-PANEL DISPLAYS
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Patent #:
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Issue Dt:
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10/17/2023
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Application #:
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17954628
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Filing Dt:
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09/28/2022
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Publication #:
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Pub Dt:
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01/26/2023
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Title:
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DIFFUSION BARRIERS FOR METALLIC SUPERCONDUCTING WIRES
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Assignee
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| 45 INDUSTRIAL PLACE |
| NEWTON, MASSACHUSETTS 02461 |
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Correspondence name and address
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MORGAN, LEWIS, & BOCKIUS LLP (B0)
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1111 PENNSYLVANIA AVENUE, NW
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WASHINGTON, DC 20004
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