Patent Assignment Details
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| Reel/Frame: | 012679/0893 | |
| Pages: | 3 |
| | Recorded: | 02/19/2002 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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04/06/2004
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Application #:
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09952038
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Filing Dt:
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09/11/2001
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Publication #:
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Pub Dt:
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03/13/2003
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Title:
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SEMICONDUCTOR PACKAGE PRODUCTION METHOD AND SEMICONDUCTOR PACKAGE
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Assignee
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| 21-11, NISHI-GOTANDA 7-CHOME, SHINAGAWA-KU |
| TOKYO, JAPAN 141-0 |
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Correspondence name and address
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ANDERSON. LEVINE & LINTEL
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RODNEY M. ANDERSON
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12160 ABRAMS ROAD
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SUITE 111
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DALLAS, TX 75243
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