Patent Assignment Details
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Reel/Frame: | 020302/0896 | |
| Pages: | 5 |
| | Recorded: | 12/28/2007 | | |
Attorney Dkt #: | 108298923US |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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12/27/2011
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Application #:
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11966824
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Filing Dt:
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12/28/2007
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Publication #:
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Pub Dt:
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07/02/2009
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Title:
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PASS-THROUGH 3D INTERCONNECT FOR MICROELECTRONIC DIES AND ASSOCIATED SYSTEMS AND METHODS
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Assignee
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8000 SOUTH FEDERAL WAY, P.O. BOX 6 |
BOISE, IDAHO 83716-9632 |
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Correspondence name and address
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PERKINS COIE LLP
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PO BOX 1247
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PAUL T. PARKER
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SEATTLE, WA 98111-1247
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