Patent Assignment Details
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| Reel/Frame: | 012511/0897 | |
| Pages: | 3 |
| | Recorded: | 01/24/2002 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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02/15/2005
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Application #:
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09910686
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Filing Dt:
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07/20/2001
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Publication #:
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Pub Dt:
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09/12/2002
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Title:
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METHOD OF SEALING WAFER BACKSIDE FOR FULL-FACE ELECTROCHEMICAL PLATING
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Assignee
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| 1645 MCCANDLESS DRIVE |
| MILPITAS, CALIFORNIA 95035 |
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Correspondence name and address
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PILLSBURY WINTHROP, LLP
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DAVID A. JAKOPIN
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1600 TYSONS BOULEVARD
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MCLEAN, VA 22102
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