Patent Assignment Details
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Reel/Frame: | 009346/0898 | |
| Pages: | 4 |
| | Recorded: | 12/17/1996 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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02/16/1999
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Application #:
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08768363
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Filing Dt:
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12/17/1996
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Title:
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SEMICONDUCTOR DEVICE PACKAGE INCLUDING A THICK INTEGRATED CIRCUIT CHIP STACK
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Correspondence name and address
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WYATT, GERBER, MELLER & O'ROURKE, L.L.P.
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MICHAEL N. MELLER
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99 PARK AVENUE
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NEW YORK, NY 10016-1501
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