Patent Assignment Details
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| Reel/Frame: | 033224/0898 | |
| Pages: | 4 |
| | Recorded: | 07/01/2014 | | |
| Attorney Dkt #: | 0128/0118PUS1 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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14369120
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Filing Dt:
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06/26/2014
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Publication #:
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Pub Dt:
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12/25/2014
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Title:
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METHOD FOR REMOVING SOLDER BALLS FROM CHIP
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Assignee
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| NO.5, HANJIANG ROAD, WUXI NEW DISTRICT WUXI |
| JIANGSU, CHINA 214028 |
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Correspondence name and address
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MUNCY, GEISSLER, OLDS & LOWE, P.C.
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4000 LEGATO ROAD
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SUITE 310
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FAIRFAX, VA 22033
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06/27/2024 02:29 PM
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