Patent Assignment Details
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| Reel/Frame: | 017415/0899 | |
| Pages: | 2 |
| | Recorded: | 12/23/2005 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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03/10/2009
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Application #:
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11317759
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Filing Dt:
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12/23/2005
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Publication #:
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Pub Dt:
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06/29/2006
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Title:
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METHODS OF FORMING INTERCONNECTION LINES IN SEMICONDUCTOR DEVICES
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Assignee
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| 891-10 DAECHI-DONG, KANGNAM-KU |
| A KOREAN CORPORATION |
| SEOUL 135-523, KOREA, REPUBLIC OF |
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Correspondence name and address
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MARK C. ZIMMERMAN
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HANLEY, FLIGHT & ZIMMERMAN, LLP
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20 NORTH WACKER DRIVE
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SUITE 4200
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CHICAGO, IL 60606
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