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Reel/Frame:009153/0902   Pages: 3
Recorded: 04/27/1998
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
07/06/1999
Application #:
08995235
Filing Dt:
12/19/1997
Title:
AN ASSEMBLY FOR DISSIPATING HEAT FROM A SEMICONDUCTOR CHIP WHEREIN A STRESS ON THE SEMICONDUCTOR CHIP DUE TO A THERMALLY CONDUCTIVE MEMBER IS PARTIALLY RELIEVED
Assignors
1
Exec Dt:
04/10/1998
2
Exec Dt:
04/20/1998
3
Exec Dt:
04/13/1998
4
Exec Dt:
04/13/1998
Assignee
1
2200 MISSION COLLEGE BLVD.
SANTA CLARA, CALIFORNIA 95052
Correspondence name and address
BLAKELY, SOKOLOFF, TAYLOR, ET AL.
RICHARD L. GREGORY, JR.
12400 WILSHIRE BLVD.
7TH FLOOR
LOS ANGELES, CA 90025

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