Patent Assignment Details
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Reel/Frame: | 015224/0902 | |
| Pages: | 2 |
| | Recorded: | 04/14/2004 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10824223
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Filing Dt:
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04/14/2004
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Publication #:
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Pub Dt:
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11/04/2004
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Title:
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Function module with built-in plate-type heat dissipation device
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Assignee
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NO. 188, WEN HWA 2ND RD., KUEI SHAN HSIANG |
TAO YUAN SHIEN, TAIWAN R.O.C. |
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Correspondence name and address
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THOMAS KAYDEN HORSTEMEYER ET.AL.
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DANIEL R. MCCLURE
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100 GALLERIA PARKWAY, SUITE 1750
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ATLANTA, GA 30339-5948
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