Patent Assignment Details
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| Reel/Frame: | 069425/0902 | |
| Pages: | 3 |
| | Recorded: | 11/27/2024 | | |
| Attorney Dkt #: | 4448-0915PUS1 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18662141
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Filing Dt:
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05/13/2024
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Publication #:
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Pub Dt:
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01/02/2025
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Title:
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SEMICONDUCTOR CIRCUIT STRUCTURE WITH DIRECT DIE HEAT REMOVAL STRUCTURE
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Assignee
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| 10 F., NO. 22, LN. 35, JIHU RD., NEIHU DIST. |
| TAIPEI CITY, TAIWAN 114754 |
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Correspondence name and address
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ANH-VU DAO
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BSKB, LLP
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2600 PARK TOWER DRIVE, SUITE 600
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VIENNA, VA 22180
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