Patent Assignment Details
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Reel/Frame: | 018358/0903 | |
| Pages: | 3 |
| | Recorded: | 10/06/2006 | | |
Attorney Dkt #: | 9903-140 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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09/14/2010
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Application #:
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11539133
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Filing Dt:
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10/05/2006
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Publication #:
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Pub Dt:
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07/05/2007
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Title:
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WIRING SUBSTRATE HAVING VARIOUSLY SIZED BALL PADS, SEMICONDUCTOR PACKAGE HAVING THE WIRING SUBSTRATE, AND STACK PACKAGE USING THE SEMICONDUCTOR PACKAGE
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Assignee
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416 MAETAN-DONG, YEONGTONG-GU, SUWON-SI |
GYEONGGI-DO, KOREA, REPUBLIC OF |
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Correspondence name and address
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HOSOON LEE
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210 SW MORRISON STREET, SUITE 400
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PORTLAND, OR 97204
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