Patent Assignment Details
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Reel/Frame: | 039685/0903 | |
| Pages: | 3 |
| | Recorded: | 08/10/2016 | | |
Attorney Dkt #: | ETI-SC0022-US |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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10/18/2016
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Application #:
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14706148
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Filing Dt:
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05/07/2015
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Publication #:
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Pub Dt:
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11/10/2016
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Title:
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HIGH HEAT-DISSIPATION CHIP PACKAGE STRUCTURE
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Assignee
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P. O. BOX 3321, ROAD TOWN |
TORTOLA , VIRGIN ISLANDS, BRITISH |
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Correspondence name and address
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CHUNG HSING TZU
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4F, NO. 357, DA-NAN ROAD
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SHIH-LIN AREA
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TAIPEI CITY, TAIWAN R.O.C.
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