Patent Assignment Details
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Reel/Frame: | 055818/0903 | |
| Pages: | 3 |
| | Recorded: | 04/05/2021 | | |
Attorney Dkt #: | 1012-2895 / 2020P04692 US |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/02/2022
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Application #:
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17190804
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Filing Dt:
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03/03/2021
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Title:
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MOLDED SEMICONDUCTOR MODULE FOR PCB EMBEDDING
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Assignee
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AM CAMPEON 1-15 |
NEUBIBERG, GERMANY 85579 |
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Correspondence name and address
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MURPHY, BILAK & HOMILLER, PLLC
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1255 CRESCENT GREEN, SUITE 200
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CARY, 27518 UNITED STATES
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