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Reel/Frame:	068541/0903			Pages:	16
		Recorded:	09/10/2024
Attorney Dkt #:	2010-TRANSFERS
Conveyance:	ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).

Total properties: 41

Patent #:	7772036	Issue Dt:	08/10/2010	Application #:	11398944	Filing Dt:	04/06/2006
Publication #:	US20070238205	Pub Dt:	10/11/2007
Title:	LEAD FRAME BASED, OVER-MOLDED SEMICONDUCTOR PACKAGE WITH INTEGRATED THROUGH HOLE TECHNOLOGY (THT) HEAT SPREADER PIN(S) AND ASSOCIATED METHOD OF MANUFACTURING

Patent #:	8736034	Issue Dt:	05/27/2014	Application #:	11816038	Filing Dt:	08/10/2007
Publication #:	US20080142935	Pub Dt:	06/19/2008
Title:	LEAD-FRAME CIRCUIT PACKAGE

Patent #:	8394713	Issue Dt:	03/12/2013	Application #:	12705021	Filing Dt:	02/12/2010
Publication #:	US20110198751	Pub Dt:	08/18/2011
Title:	Method of Improving Adhesion of Bond Pad Over Pad Metallization with a Neighboring Passivation Layer by Depositing a Palladium Layer

Patent #:	8659146	Issue Dt:	02/25/2014	Application #:	12813903	Filing Dt:	06/11/2010
Publication #:	US20100237479	Pub Dt:	09/23/2010
Title:	LEAD FRAME BASED, OVER-MOLDED SEMICONDUCTOR PACKAGE WITH INTEGRATED THROUGH HOLE TECHNOLOGY (THT) HEAT SPREADER PIN(S) AND ASSOCIATED METHOD OF MANUFACTURING

Patent #:	8536684	Issue Dt:	09/17/2013	Application #:	13092162	Filing Dt:	04/22/2011
Publication #:	US20120018858	Pub Dt:	01/26/2012
Title:	METHOD OF ASSEMBLING SHIELDED INTEGRATED CIRCUIT DEVICE

Patent #:	8716846	Issue Dt:	05/06/2014	Application #:	13293119	Filing Dt:	11/10/2011
Publication #:	US20120168884	Pub Dt:	07/05/2012
Title:	PRESSURE SENSOR AND METHOD OF PACKAGING SAME

Patent #:	8859336	Issue Dt:	10/14/2014	Application #:	13398816	Filing Dt:	02/16/2012
Publication #:	US20120238058	Pub Dt:	09/20/2012
Title:	METHOD OF PACKAGING SEMICONDUCTOR DIE WITH CAP ELEMENT

Patent #:	8890308	Issue Dt:	11/18/2014	Application #:	13441448	Filing Dt:	04/06/2012
Publication #:	US20130264692	Pub Dt:	10/10/2013
Title:	INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING THE SAME

Patent #:	8810020	Issue Dt:	08/19/2014	Application #:	13530118	Filing Dt:	06/22/2012
Publication #:	US20130341796	Pub Dt:	12/26/2013
Title:	SEMICONDUCTOR DEVICE WITH REDISTRIBUTED CONTACTS

Patent #:	8790964	Issue Dt:	07/29/2014	Application #:	13538585	Filing Dt:	06/29/2012
Publication #:	US20140001655	Pub Dt:	01/02/2014
Title:	POWER TRANSISTOR WITH HEAT DISSIPATION AND METHOD THEREFOR

Patent #:	8643189	Issue Dt:	02/04/2014	Application #:	13550627	Filing Dt:	07/17/2012
Publication #:	US20140021621	Pub Dt:	01/23/2014
Title:	PACKAGED SEMICONDUCTOR DIE WITH POWER RAIL PADS

Patent #:	9159643	Issue Dt:	10/13/2015	Application #:	13618185	Filing Dt:	09/14/2012
Publication #:	US20140077352	Pub Dt:	03/20/2014
Title:	MATRIX LID HEATSPREADER FOR FLIP CHIP PACKAGE

Patent #:	8836105	Issue Dt:	09/16/2014	Application #:	13681437	Filing Dt:	11/20/2012
Publication #:	US20140027896	Pub Dt:	01/30/2014
Title:	SEMICONDUCTOR DEVICE PACKAGE WITH CAP ELEMENT

Patent #:	9064838	Issue Dt:	06/23/2015	Application #:	14029779	Filing Dt:	09/17/2013
Publication #:	US20150076680	Pub Dt:	03/19/2015
Title:	HEAT SPREADER FOR INTEGRATED CIRCUIT DEVICE

Patent #:	9676611	Issue Dt:	06/13/2017	Application #:	14057262	Filing Dt:	10/18/2013
Publication #:	US20150108653	Pub Dt:	04/23/2015
Title:	SENSOR DEVICE PACKAGES AND RELATED FABRICATION METHODS

Patent #:	9190352	Issue Dt:	11/17/2015	Application #:	14086942	Filing Dt:	11/21/2013
Publication #:	US20150137279	Pub Dt:	05/21/2015
Title:	MULTI-DIE SENSOR DEVICE

Patent #:	9305898	Issue Dt:	04/05/2016	Application #:	14161706	Filing Dt:	01/23/2014
Publication #:	US20150206834	Pub Dt:	07/23/2015
Title:	SEMICONDUCTOR DEVICE WITH COMBINED POWER AND GROUND RING STRUCTURE

Patent #:	8802474	Issue Dt:	08/12/2014	Application #:	14219011	Filing Dt:	03/19/2014
Publication #:	US20140206124	Pub Dt:	07/24/2014
Title:	PRESSURE SENSOR AND METHOD OF PACKAGING SAME

Patent #:	9297713	Issue Dt:	03/29/2016	Application #:	14220121	Filing Dt:	03/19/2014
Publication #:	US20150270206	Pub Dt:	09/24/2015
Title:	PRESSURE SENSOR DEVICE WITH THROUGH SILICON VIA

Patent #:	NONE	Issue Dt:		Application #:	14285079	Filing Dt:	05/22/2014
Publication #:	US20140252570	Pub Dt:	09/11/2014
Title:	LEAD-FRAME CIRCUIT PACKAGE

Patent #:	9129930	Issue Dt:	09/08/2015	Application #:	14331724	Filing Dt:	07/15/2014
Publication #:	US20140327124	Pub Dt:	11/06/2014
Title:	POWER TRANSISTOR WITH HEAT DISSIPATION AND METHOD THEREFORE

Patent #:	9685351	Issue Dt:	06/20/2017	Application #:	14335366	Filing Dt:	07/18/2014
Publication #:	US20160020182	Pub Dt:	01/21/2016
Title:	Wire Bond Mold Lock Method and Structure

Patent #:	9093438	Issue Dt:	07/28/2015	Application #:	14459331	Filing Dt:	08/14/2014
Publication #:	US20140357023	Pub Dt:	12/04/2014
Title:	SEMICONDUCTOR DEVICE PACKAGE WITH CAP ELEMENT

Patent #:	9196578	Issue Dt:	11/24/2015	Application #:	14459337	Filing Dt:	08/14/2014
Title:	COMMON PIN FOR MULTI-DIE SEMICONDUCTOR PACKAGE

Patent #:	9299645	Issue Dt:	03/29/2016	Application #:	14551075	Filing Dt:	11/23/2014
Publication #:	US20150279765	Pub Dt:	10/01/2015
Title:	SEMICONDUCTOR DEVICE HAVING LEAD FRAME WITH NOTCHED INNER LEADS

Patent #:	9613941	Issue Dt:	04/04/2017	Application #:	14552442	Filing Dt:	11/24/2014
Publication #:	US20150255443	Pub Dt:	09/10/2015
Title:	EXPOSED DIE POWER SEMICONDUCTOR DEVICE

Patent #:	9548263	Issue Dt:	01/17/2017	Application #:	14741088	Filing Dt:	06/16/2015
Publication #:	US20160372405	Pub Dt:	12/22/2016
Title:	SEMICONDUCTOR DEVICE PACKAGE FOR DEBUGGING AND RELATED FABRICATION METHODS

Patent #:	9299646	Issue Dt:	03/29/2016	Application #:	14833135	Filing Dt:	08/23/2015
Title:	LEAD FRAME WITH POWER AND GROUND BARS

Patent #:	9355945	Issue Dt:	05/31/2016	Application #:	14843967	Filing Dt:	09/02/2015
Title:	SEMICONDUCTOR DEVICE WITH HEAT-DISSIPATING LEAD FRAME

Patent #:	9640469	Issue Dt:	05/02/2017	Application #:	14850070	Filing Dt:	09/10/2015
Publication #:	US20160005682	Pub Dt:	01/07/2016
Title:	Matrix Lid Heatspreader for Flip Chip Package

Patent #:	9362212	Issue Dt:	06/07/2016	Application #:	14850958	Filing Dt:	09/11/2015
Title:	INTEGRATED CIRCUIT PACKAGE HAVING SIDE AND BOTTOM CONTACT PADS

Patent #:	10364140	Issue Dt:	07/30/2019	Application #:	14861886	Filing Dt:	09/22/2015
Publication #:	US20170081174	Pub Dt:	03/23/2017
Title:	INTEGRATING DIVERSE SENSORS IN A SINGLE SEMICONDUCTOR DEVICE

Patent #:	9449901	Issue Dt:	09/20/2016	Application #:	14887304	Filing Dt:	10/19/2015
Publication #:	US20160293526	Pub Dt:	10/06/2016
Title:	LEAD FRAME WITH DEFLECTING TIE BAR FOR IC PACKAGE

Patent #:	10151658	Issue Dt:	12/11/2018	Application #:	15356622	Filing Dt:	11/20/2016
Publication #:	US20170292884	Pub Dt:	10/12/2017
Title:	PRESSURE-SENSING INTEGRATED CIRCUIT DEVICE WITH DIAPHRAGM

Patent #:	10381295	Issue Dt:	08/13/2019	Application #:	15701572	Filing Dt:	09/12/2017
Publication #:	US20190080991	Pub Dt:	03/14/2019
Title:	LEAD FRAME HAVING REDISTRIBUTION LAYER

Patent #:	10431534	Issue Dt:	10/01/2019	Application #:	15864348	Filing Dt:	01/08/2018
Publication #:	US20190181079	Pub Dt:	06/13/2019
Title:	PACKAGE WITH SUPPORT STRUCTURE

Patent #:	10217700	Issue Dt:	02/26/2019	Application #:	15980572	Filing Dt:	05/15/2018
Title:	LEAD FRAME FOR INTEGRATED CIRCUIT DEVICE HAVING J-LEADS AND GULL WING LEADS

Patent #:	10566268	Issue Dt:	02/18/2020	Application #:	16142623	Filing Dt:	09/26/2018
Title:	PACKAGE TO DIE CONNECTION SYSTEM AND METHOD THEREFOR

Patent #:	11021363	Issue Dt:	06/01/2021	Application #:	16440446	Filing Dt:	06/13/2019
Publication #:	US20190292042	Pub Dt:	09/26/2019
Title:	INTEGRATING DIVERSE SENSORS IN A SINGLE SEMICONDUCTOR DEVICE

Patent #:	11498829	Issue Dt:	11/15/2022	Application #:	16744577	Filing Dt:	01/16/2020
Publication #:	US20210221671	Pub Dt:	07/22/2021
Title:	NO-GEL PRESSURE SENSOR PACKAGE

Patent #:	11760623	Issue Dt:	09/19/2023	Application #:	18045677	Filing Dt:	10/11/2022
Publication #:	US20230059566	Pub Dt:	02/23/2023
Title:	NO-GEL PRESSURE SENSOR PACKAGE

Assignor

NXP USA, INC.

Exec Dt:

07/31/2024

Assignee

CHIP PACKAGING TECHNOLOGIES, LLC

5830 GRANITE PARKWAY

SUITE #100-216

PLANO, TEXAS 75024

Correspondence name and address
	JANEAN HARGIS
	P.O. BOX 890226
	HOUSTON, TX 77062-9998

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