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Total properties:
12
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Patent #:
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Issue Dt:
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01/03/1995
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Application #:
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08171696
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Filing Dt:
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12/22/1993
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Title:
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HYBRID CIRCUITS AND A METHOD OF MANUFACTURE
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Patent #:
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Issue Dt:
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05/06/1997
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Application #:
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08689388
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Filing Dt:
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08/12/1996
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Title:
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INVERTED CHIP BONDED MODULE WITH HIGH PACKAGING EFFICIENCY
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Patent #:
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Issue Dt:
|
02/02/1999
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Application #:
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08767160
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Filing Dt:
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12/16/1996
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Title:
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INVERTED CHIP BONDED MODULE WITH HIGH PACKAGING EFFICIENCY
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Patent #:
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Issue Dt:
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08/11/1998
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Application #:
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08811114
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Filing Dt:
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03/03/1997
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Title:
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INVERTED CHIP BONDED MODULE WITH HIGH PACKAGING EFFICIENCY
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Patent #:
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Issue Dt:
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05/18/1999
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Application #:
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08906045
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Filing Dt:
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08/05/1997
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Title:
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PACKAGE FOR POWER SEMICONDUCTOR CHIPS
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Patent #:
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Issue Dt:
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12/26/2000
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Application #:
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09311081
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Filing Dt:
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05/13/1999
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Title:
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PACKAGE FOR ELECTRONIC DEVICES
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Patent #:
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Issue Dt:
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05/14/2002
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Application #:
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09633631
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Filing Dt:
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08/07/2000
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Title:
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OPTOCOUPLER PACKAGE BEING HERMETICALLY SEALED
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Patent #:
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Issue Dt:
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09/02/2003
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Application #:
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09737408
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Filing Dt:
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12/15/2000
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Publication #:
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Pub Dt:
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07/03/2003
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Title:
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INTERCONNECTION METHOD ENTAILING PROTUBERANCES FORMED BY MELTING METAL OVER CONTACT AREAS
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Patent #:
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Issue Dt:
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09/02/2003
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Application #:
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09745966
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Filing Dt:
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12/22/2000
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Title:
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MODULE WITH BUMPS FOR CONNECTION AND SUPPORT
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Patent #:
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Issue Dt:
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11/07/2006
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Application #:
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10650265
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Filing Dt:
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08/28/2003
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Title:
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INTERCONNECTION METHOD
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Patent #:
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Issue Dt:
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09/02/2008
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Application #:
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10718169
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Filing Dt:
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11/20/2003
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Title:
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DIGITAL INTEGRATION METHOD
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Patent #:
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Issue Dt:
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09/18/2007
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Application #:
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10989882
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Filing Dt:
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11/16/2004
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Title:
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HIGH DENSITY ELECTRONIC INTERCONNECTION
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