Patent Assignment Details
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Reel/Frame: | 038391/0904 | |
| Pages: | 3 |
| | Recorded: | 04/27/2016 | | |
Attorney Dkt #: | CUL-037C2 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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11/15/2016
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Application #:
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14953840
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Filing Dt:
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11/30/2015
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Publication #:
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Pub Dt:
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03/24/2016
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Title:
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WAFER-LEVEL FLIP CHIP DEVICE PACKAGES AND RELATED METHODS
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Assignee
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13551 COMMERCE PARKWAY |
SUITE 120 |
RICHMOND, BRITISH COLUMBIA, CANADA V6V 2L1 |
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Correspondence name and address
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MORGAN, LEWIS, & BOCKIOUS LLP (B0)
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1111 PENNSYLVANIA AVENUE, NW​
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WASHINGTON, DC 20004-2541
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