Total properties:
17
|
|
Patent #:
|
|
Issue Dt:
|
06/11/2002
|
Application #:
|
09080264
|
Filing Dt:
|
05/18/1998
|
Title:
|
ELECTROCHEMICAL MACHINING USING MODULATED REVERSE ELECTRIC FIELDS
|
|
|
Patent #:
|
|
Issue Dt:
|
03/20/2001
|
Application #:
|
09172299
|
Filing Dt:
|
10/14/1998
|
Title:
|
PULSE REVERSE ELECTRODEPOSITION FOR METALLIZATION AND PLANARIZATION OF SEMICONDUCTOR SUBSTRATES
|
|
|
Patent #:
|
|
Issue Dt:
|
04/24/2001
|
Application #:
|
09200959
|
Filing Dt:
|
11/30/1998
|
Title:
|
REMOVAL OF SACRIFICIAL CORES BY ELECTROCHEMICAL MACHINING
|
|
|
Patent #:
|
|
Issue Dt:
|
04/03/2001
|
Application #:
|
09239811
|
Filing Dt:
|
01/29/1999
|
Title:
|
ELECTRODEPOSITION OF METALS IN SMALL RECESSES FOR MANUFACTURE OF HIGH DENSITY INTERCONNECTS USING REVERSE PULS PLATING
|
|
|
Patent #:
|
|
Issue Dt:
|
10/30/2001
|
Application #:
|
09419881
|
Filing Dt:
|
10/18/1999
|
Title:
|
SEQUENTIAL ELECTRODEPOSITION OF METALS USING MODULATED ELECTRIC FIELDS FOR MANUFACTURE OF CIRCUIT BOARDS HAVING FEATURES OF DIFFERENT SIZES
|
|
|
Patent #:
|
|
Issue Dt:
|
10/16/2001
|
Application #:
|
09553616
|
Filing Dt:
|
04/20/2000
|
Title:
|
Electrodeposition of metals in small recesses using modulated electric fields
|
|
|
Patent #:
|
|
Issue Dt:
|
11/20/2001
|
Application #:
|
09553623
|
Filing Dt:
|
04/20/2000
|
Title:
|
Pulse reverse electrodeposition for metallization and planarization of semiconductor substrates
|
|
|
Patent #:
|
|
Issue Dt:
|
04/22/2003
|
Application #:
|
09688377
|
Filing Dt:
|
10/17/2000
|
Title:
|
ELECTRODEPOSITION OF METALS FOR FORMING THREE-DIMENSIONAL MICROSTRUCTURES
|
|
|
Patent #:
|
|
Issue Dt:
|
05/06/2003
|
Application #:
|
09688378
|
Filing Dt:
|
10/17/2000
|
Title:
|
SEQUENTIAL ELECTROMACHINING AND ELECTROPOLISHING OF METALS AND THE LIKE USING MODULATED ELECTRIC FIELDS
|
|
|
Patent #:
|
|
Issue Dt:
|
02/25/2003
|
Application #:
|
09823749
|
Filing Dt:
|
04/03/2001
|
Publication #:
|
|
Pub Dt:
|
05/16/2002
| | | | |
Title:
|
ELECTRODEPOSITION OF METALS IN SMALL RECESSES USING MODULATED ELECTRIC FIELDS
|
|
|
Patent #:
|
|
Issue Dt:
|
03/08/2005
|
Application #:
|
09823750
|
Filing Dt:
|
04/03/2001
|
Publication #:
|
|
Pub Dt:
|
04/04/2002
| | | | |
Title:
|
SEQUENTIAL ELECTRODEPOSITION OF METALS USING MODULATED ELECTRIC FIELDS FOR MANUFACTURE OF CIRCUIT BOARDS HAVING FEATURES OF DIFFERENT SIZES
|
|
|
Patent #:
|
|
Issue Dt:
|
04/12/2005
|
Application #:
|
09823751
|
Filing Dt:
|
04/03/2001
|
Publication #:
|
|
Pub Dt:
|
03/21/2002
| | | | |
Title:
|
PULSE REVERSE ELECTRODEPOSITION FOR METALLIZATION AND PLANARIZATION OF SEMICONDUCTOR SUBSTRATES
|
|
|
Patent #:
|
|
Issue Dt:
|
01/13/2004
|
Application #:
|
09856974
|
Filing Dt:
|
05/30/2001
|
Title:
|
REMOVAL OF SACRIFICIAL CORES BY ELECTROCHEMICAL MACHINING
|
|
|
Patent #:
|
|
Issue Dt:
|
12/07/2004
|
Application #:
|
09975974
|
Filing Dt:
|
10/15/2001
|
Publication #:
|
|
Pub Dt:
|
04/24/2003
| | | | |
Title:
|
ELECTRODEPOSITION OF METALS IN HIGH-ASPECT RATIO CAVITIES USING MODULATED REVERSE ELECTRIC FIELDS
|
|
|
Patent #:
|
|
Issue Dt:
|
11/25/2003
|
Application #:
|
10132399
|
Filing Dt:
|
04/26/2002
|
Publication #:
|
|
Pub Dt:
|
01/16/2003
| | | | |
Title:
|
SEQUENTIAL ELECTRODEPOSITION OF METALS USING MODULATED ELECTRIC FIELDS FOR MANUFACTURE OF CIRCUIT BOARDS HAVING FEATURES OF DIFFERENT SIZES
|
|
|
Patent #:
|
|
Issue Dt:
|
06/15/2004
|
Application #:
|
10367600
|
Filing Dt:
|
02/14/2003
|
Publication #:
|
|
Pub Dt:
|
09/25/2003
| | | | |
Title:
|
METHOD FOR ELECTROCHEMICAL METALLIZATION AND PLANARIZATION OF SEMICONDUCTOR SUBSTRATES HAVING FEATURES OF DIFFERENT SIZES
|
|
|
Patent #:
|
|
Issue Dt:
|
04/04/2006
|
Application #:
|
10459105
|
Filing Dt:
|
06/11/2003
|
Publication #:
|
|
Pub Dt:
|
01/08/2004
| | | | |
Title:
|
ELECTROLYTIC ETCHING OF METAL LAYERS
|
|