Patent Assignment Details
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| Reel/Frame: | 010761/0907 | |
| Pages: | 3 |
| | Recorded: | 04/21/2000 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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11/12/2002
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Application #:
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09556733
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Filing Dt:
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04/21/2000
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Title:
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METHOD OF ETCHING MATERIAL FILM FORMED ON SEMICONDUCTOR WAFER USING SURFACE WAVE COUPLED PLASMA ETCHING APPARATUS
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Assignee
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| 416, MAETAN-DONG, PALDAL-GU |
| SUWON-CITY, KYUNGKI-DO, KOREA, REPUBLIC OF |
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Correspondence name and address
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F. CHAU & ASSOCIATES, LLP
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FRANK CHAU, ESQ.
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1900 HEMPSTEAD TURNPIKE, SUITE 501
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EAST MEADOW, NY 11554
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