Patent Assignment Details
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| Reel/Frame: | 018626/0907 | |
| Pages: | 4 |
| | Recorded: | 11/22/2006 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10558551
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Filing Dt:
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11/22/2006
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Publication #:
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Pub Dt:
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05/10/2007
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Title:
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Solder paste
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Assignee
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| 23 SENJU-HASHIDO-CHO |
| ADACHI-KU |
| TOKYO 120-8555, JAPAN |
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Correspondence name and address
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MICHAEL TOBIAS
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#40
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1717 K ST. NW, SUITE 613
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WASHINGTON, DC 20036
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