Patent Assignment Details
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Reel/Frame: | 016563/0908 | |
| Pages: | 2 |
| | Recorded: | 05/11/2005 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11127423
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Filing Dt:
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05/11/2005
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Publication #:
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Pub Dt:
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11/17/2005
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Title:
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Copper film containing tungsten nitride for improving thermal stability, electrical conductivity and electric leakage properties and a manufacturing method for the copper film
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Assignee
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NO. 2, PEI-NING ROAD |
KEELUNG, TAIWAN R.O.C. |
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Correspondence name and address
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JAMES H. WALTERS
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DELLETT & WALTERS
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P.O. BOX 2786
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PORTLAND, OR 97208-2786
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