Patent Assignment Details
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| Reel/Frame: | 018548/0908 | |
| Pages: | 10 |
| | Recorded: | 11/02/2006 | | |
| Attorney Dkt #: | G0100 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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03/01/2011
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Application #:
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11592889
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Filing Dt:
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11/02/2006
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Title:
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EXPOSED DIE OVERMOLDED FLIP CHIP PACKAGE AND FABRICATION METHOD
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Assignee
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| 1900 SOUTH PRICE ROAD |
| CHANDLER, ARIZONA 85248-1604 |
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Correspondence name and address
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SERGE J. HODGSON
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GUNNISON, MCKAY & HODGSON, L.L.P.
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GARDEN WEST OFFICE PLAZA
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SUITE 220, 1900 GARDEN ROAD
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MONTEREY, CA 93940
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