Patent Assignment Details
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Reel/Frame: | 027566/0908 | |
| Pages: | 5 |
| | Recorded: | 01/20/2012 | | |
Attorney Dkt #: | PRA11-0013 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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11/10/2015
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Application #:
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13314995
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Filing Dt:
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12/08/2011
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Publication #:
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Pub Dt:
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06/13/2013
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Title:
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DESIGN OF A HEAT DISSIPATION STRUCTURE FOR AN INTEGRATED CIRCUIT (IC) CHIP
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Assignee
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500 ORACLE PARKWAY |
MAIL STOP 5OP7 |
REDWOOD CITY, CALIFORNIA 94065 |
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Correspondence name and address
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A. RICHARD PARK
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PARK, VAUGHAN, FLEMING & DOWLER LLP
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2820 FIFTH STREET
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DAVIS, CA 95618
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