Patent Assignment Details
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Reel/Frame: | 042787/0908 | |
| Pages: | 7 |
| | Recorded: | 06/22/2017 | | |
Attorney Dkt #: | 20151393/24061-3344US01 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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06/26/2018
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Application #:
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15282981
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Filing Dt:
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09/30/2016
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Publication #:
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Pub Dt:
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04/05/2018
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Title:
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METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT FABRICATION
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Assignee
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NO. 8, LI-HSIN RD. 6, |
SCIENCE-BASED INDUSTRIAL PARK |
HSIN-CHU, TAIWAN 300-77 |
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Correspondence name and address
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HAYNES AND BOONE, LLP IP SECTION
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2323 VICTORY AVENUE
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SUITE 700
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DALLAS, TX 75219
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