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Patent Assignment Details
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Reel/Frame:028832/0909   Pages: 2
Recorded: 08/23/2012
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
03/01/2016
Application #:
13592351
Filing Dt:
08/23/2012
Publication #:
Pub Dt:
02/27/2014
Title:
HEAT PIPE STRUCTURE, AND THERMAL MODULE AND ELECTRONIC DEVICE USING SAME
Assignor
1
Exec Dt:
08/23/2012
Assignee
1
7F.-3, NO. 24, WUCYUAN 2ND ROAD
SINJHUANG DISTRICT, NEW TAIPEI CITY, TAIWAN
Correspondence name and address
ASIA VITAL COMPONENTS CO., LTD
7F, NO. 283, SEC 2, FUSHING S. RD.
TAIPEI CITY, 106 TAIWAN

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