Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
| Reel/Frame: | 059008/0909 | |
| Pages: | 6 |
| | Recorded: | 02/10/2022 | | |
| Attorney Dkt #: | 102351-1286-A01727/US8612 |
| Conveyance: | CORRECTIVE ASSIGNMENT TO CORRECT THE FIRST AND MIDDLE NAME OF THE FOURTH INVENTOR PREVIOUSLY RECORDED ON REEL 048375 FRAME 0934. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. |
|
|
Total properties:
1
|
|
|
|
Patent #:
|
|
Issue Dt:
|
01/05/2021
|
Application #:
|
16264602
|
Filing Dt:
|
01/31/2019
|
|
Publication #:
|
|
Pub Dt:
|
04/16/2020
| | | | |
|
Title:
|
SEMICONDUCTOR DEVICE PACKAGE, ELECTRONIC ASSEMBLY AND METHOD FOR MANUFACTURING THE SAME
|
|
|
Assignee
|
|
|
|
|
| 26 CHIN 3RD ROAD, NANTZE EXPORT PROCESSING ZONE |
| KAOHSIUNG, TAIWAN |
|
|
Correspondence name and address
|
| |
FOLEY & LARDNER LLP
|
| |
3000 K STREET, N.W.
|
| |
SUITE 600
|
| |
WASHINGTON, DC 20007
|
Search Results as of:
06/23/2024 05:55 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
