Patent Assignment Details
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Reel/Frame: | 009403/0910 | |
| Pages: | 3 |
| | Recorded: | 08/19/1998 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/08/2000
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Application #:
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09136544
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Filing Dt:
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08/19/1998
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Title:
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STRUCTURE OF A BONDING PAD FOR SEMICONDUCTOR DEVICES
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Assignee
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SCIENCE-BASED INDUSTRIAL PARK |
NO. 3, LI-HSIN RD. 2 |
HSIN-CHU CITY, TAIWAN R.O.C |
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Correspondence name and address
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THOMAS, KAYDEN, HORSTEMEYER ET AL.
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DANIEL R. MCCLURE
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100 GALLERIA PARKWAY, SUITE 1500
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ATLANTA, GA 30339
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