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Total properties:
25
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Patent #:
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Issue Dt:
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10/28/2003
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Application #:
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09466535
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Filing Dt:
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12/17/1999
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Publication #:
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Pub Dt:
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05/30/2002
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Title:
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INTEGRATED CIRCUITS AND METHODS FOR THEIR FABRICATION
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Patent #:
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Issue Dt:
|
11/27/2001
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Application #:
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09519281
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Filing Dt:
|
03/07/2000
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Title:
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Plasma processing methods and apparatus
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Patent #:
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Issue Dt:
|
07/16/2002
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Application #:
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09538869
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Filing Dt:
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03/29/2000
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Title:
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INTEGRATED CIRCUITS AND METHODS FOR THEIR FABRICATION
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Patent #:
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Issue Dt:
|
09/30/2003
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Application #:
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09542519
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Filing Dt:
|
04/03/2000
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Title:
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PLASMA PROCESSING METHODS AND APPARATUS
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Patent #:
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|
Issue Dt:
|
07/17/2001
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Application #:
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09617211
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Filing Dt:
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07/17/2000
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Title:
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Plasma processing methods and apparatus
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Patent #:
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Issue Dt:
|
02/17/2004
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Application #:
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09716092
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Filing Dt:
|
11/16/2000
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Title:
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PACKAGING OF INTEGRATED CIRCUITS AND VERTICAL INTEGRATION
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|
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Patent #:
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Issue Dt:
|
09/10/2002
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Application #:
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09752802
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Filing Dt:
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12/28/2000
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Publication #:
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Pub Dt:
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05/17/2001
| | | | |
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Title:
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THINNING AND DICING OF SEMICONDUCTOR WAFERS USING DRY ETCH, AND OBTAINING SEMICONDUCTOR CHIPS WITH ROUNDED BOTTOM EDGES AND CORNERS
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Patent #:
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Issue Dt:
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12/23/2003
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Application #:
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09757242
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Filing Dt:
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01/08/2001
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Publication #:
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Pub Dt:
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06/07/2001
| | | | |
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Title:
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BIRM AND GAS ESCAPE FOR NON-CONTACT WAFER HOLDER
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Patent #:
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Issue Dt:
|
10/08/2002
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Application #:
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09922069
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Filing Dt:
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08/02/2001
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Publication #:
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Pub Dt:
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02/14/2002
| | | | |
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Title:
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MONITORING AND CONTROLLING SEPARATE PLASMA JETS TO ACHIEVE DESIRED PROPERTIES IN A COMBINED STREAM
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|
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Patent #:
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Issue Dt:
|
04/01/2003
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Application #:
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09922205
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Filing Dt:
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08/02/2001
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Publication #:
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Pub Dt:
|
02/07/2002
| | | | |
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Title:
|
MONITORING AND CONTROLLING SEPARATE PLASMA JETS TO ACHIEVE DESIRED PROPERTIES IN A COMBINED STREAM
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Patent #:
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Issue Dt:
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01/18/2005
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Application #:
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09941447
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Filing Dt:
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08/28/2001
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Publication #:
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Pub Dt:
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08/22/2002
| | | | |
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Title:
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FABRICATION OF SEMICONDUCTOR STRUCTURES HAVING MULTIPLE CONDUCTIVE LAYERS IN AN OPENING
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|
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Patent #:
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Issue Dt:
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10/25/2005
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Application #:
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10109233
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Filing Dt:
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03/27/2002
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Publication #:
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Pub Dt:
|
08/22/2002
| | | | |
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Title:
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METHODS OF MANUFACTURING DEVICES HAVING SUBSTRATES WITH OPENING PASSING THROUGH THE SUBSTRATES AND CONDUCTORS IN THE OPENINGS
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|
|
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Patent #:
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|
Issue Dt:
|
02/10/2004
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Application #:
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10116462
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Filing Dt:
|
04/02/2002
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Publication #:
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Pub Dt:
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03/20/2003
| | | | |
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Title:
|
DETECTION AND HANDLING OF SEMICONDUCTOR WAFERS AND WAFER-LIKE OBJECTS
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|
|
|
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Patent #:
|
|
Issue Dt:
|
05/25/2004
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Application #:
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10133595
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Filing Dt:
|
04/26/2002
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|
Publication #:
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|
Pub Dt:
|
09/12/2002
| | | | |
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Title:
|
INTEGRATED CIRCUITS AND METHODS FOR THEIR FABRICATION
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|
|
|
|
Patent #:
|
|
Issue Dt:
|
12/16/2003
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Application #:
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10265056
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Filing Dt:
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10/04/2002
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Publication #:
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Pub Dt:
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02/27/2003
| | | | |
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Title:
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ARTICLE HOLDERS WITH SENSORS DETECTING A TYPE OF ARTICLE HELD BY THE HOLDER
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|
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Patent #:
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|
Issue Dt:
|
12/16/2003
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Application #:
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10318833
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Filing Dt:
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12/12/2002
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Publication #:
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Pub Dt:
|
05/08/2003
| | | | |
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Title:
|
INTEGRATED CIRCUITS AND METHODS FOR THEIR FABRICATION
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|
|
|
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Patent #:
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|
Issue Dt:
|
06/22/2004
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Application #:
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10352607
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Filing Dt:
|
01/27/2003
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|
Publication #:
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Pub Dt:
|
08/07/2003
| | | | |
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Title:
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METHOD FOR MANUFACTURING A STRUCTURE COMPRISING A SUBSTRATE WITH A CAVITY AND A SEMICONDUCTOR INTEGRATED CIRCUIT BONDED TO A CONTACT PAD LOCATED IN THE CAVITY
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|
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Patent #:
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|
Issue Dt:
|
02/20/2007
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Application #:
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10414603
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Filing Dt:
|
04/15/2003
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|
Publication #:
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Pub Dt:
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10/23/2003
| | | | |
|
Title:
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PLASMA PROCESSING METHODS AND APPARATUS
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|
|
|
|
Patent #:
|
|
Issue Dt:
|
09/12/2006
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Application #:
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10756631
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Filing Dt:
|
01/12/2004
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|
Publication #:
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|
Pub Dt:
|
08/05/2004
| | | | |
|
Title:
|
DETECTION AND HANDLING OF SEMICONDUCTOR WAFERS AND WAFER-LIKE OBJECTS
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|
|
|
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Patent #:
|
|
Issue Dt:
|
02/21/2006
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Application #:
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11014464
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Filing Dt:
|
12/16/2004
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|
Publication #:
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Pub Dt:
|
05/19/2005
| | | | |
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Title:
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SEMICONDUCTOR STRUCTURES HAVING MULTIPLE CONDUCTIVE LAYERS IN AN OPENING, AND METHODS FOR FABRICATING SAME
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|
|
|
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Patent #:
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|
Issue Dt:
|
04/25/2006
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Application #:
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11123532
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Filing Dt:
|
05/05/2005
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|
Publication #:
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Pub Dt:
|
09/01/2005
| | | | |
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Title:
|
PACKAGING SUBSTRATES FOR INTEGRATED CIRCUITS AND SOLDERING METHODS
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|
|
|
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Patent #:
|
|
Issue Dt:
|
02/06/2007
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Application #:
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11131711
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Filing Dt:
|
05/18/2005
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|
Publication #:
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|
Pub Dt:
|
09/22/2005
| | | | |
|
Title:
|
CLOCK DISTRIBUTION NETWORKS AND CONDUCTIVE LINES IN SEMICONDUCTOR INTEGRATED CIRCUITS
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|
|
|
|
Patent #:
|
|
Issue Dt:
|
07/10/2007
|
Application #:
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11253492
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Filing Dt:
|
10/19/2005
|
|
Publication #:
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|
Pub Dt:
|
02/23/2006
| | | | |
|
Title:
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ATTACHMENT OF INTEGRATED CIRCUIT STRUCTURES AND OTHER SUBSTRATES TO SUBSTRATES WITH VIAS
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|
|
|
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Patent #:
|
|
Issue Dt:
|
03/06/2007
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Application #:
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11253943
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Filing Dt:
|
10/19/2005
|
|
Publication #:
|
|
Pub Dt:
|
02/16/2006
| | | | |
|
Title:
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INTEGRATED CIRCUITS AND PACKAGING SUBSTRATES WITH CAVITIES, AND ATTACHMENT METHODS INCLUDING INSERTION OF PROTRUDING CONTACT PADS INTO CAVITIES
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|
|
|
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Patent #:
|
|
Issue Dt:
|
04/21/2009
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Application #:
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11548053
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Filing Dt:
|
10/10/2006
|
|
Publication #:
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Pub Dt:
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06/07/2007
| | | | |
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Title:
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ELECTROPLATING AND ELECTROLESS PLATING OF CONDUCTIVE MATERIALS INTO OPENINGS, AND STRUCTURES OBTAINED THEREBY
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