Patent Assignment Details
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| Reel/Frame: | 041000/0912 | |
| Pages: | 3 |
| | Recorded: | 01/13/2017 | | |
| Attorney Dkt #: | 00150.0020.00US |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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06/26/2018
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Application #:
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15326401
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Filing Dt:
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01/13/2017
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Publication #:
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Pub Dt:
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07/27/2017
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Title:
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FABRICATING METHOD FOR WAFER-LEVEL PACKAGING
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Assignee
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| NO. 288, CHONGCHUAN ROAD, CHONGCHUAN DISTRICT |
| NANTONG, CHINA 226006 |
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Correspondence name and address
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ANOVA LAW GROUP, PLLC
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21351 GENTRY DRIVE, SUITE 150
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STERLING, VA 20166
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06/25/2024 05:55 PM
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