Patent Assignment Details
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| Reel/Frame: | 004502/0913 | |
| Pages: | 1 |
| | Recorded: | 12/27/1985 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST. |
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Total properties:
1
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Patent #:
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Issue Dt:
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06/09/1987
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Application #:
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06817086
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Filing Dt:
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12/27/1985
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Title:
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METHOD AND SYSTEM FOR AUTOMATICALLY BONDING A LEADWIRE ON A SEMICONDUCTOR
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Assignee
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| 2456 EDA-MACHI, MIDORI-KU, |
| A CORP OF JAPAN |
| YOKAHAMA, KANAGAWA 227, JAPAN |
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Correspondence name and address
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ROBERT B. WATKINS
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SUITE 3400
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50 WEST BROAD ST.,
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COLUMBUS, OH 43215
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