Total properties:
27
|
|
Patent #:
|
|
Issue Dt:
|
10/02/2001
|
Application #:
|
09164470
|
Filing Dt:
|
10/01/1998
|
Title:
|
ANGLED FLYING LEAD WIRE BONDING PROCESS
|
|
|
Patent #:
|
|
Issue Dt:
|
03/23/2004
|
Application #:
|
10342167
|
Filing Dt:
|
01/14/2003
|
Publication #:
|
|
Pub Dt:
|
06/12/2003
| | | | |
Title:
|
ANGLED FLYING LEAD WIRE BONDING PROCESS
|
|
|
Patent #:
|
|
Issue Dt:
|
09/04/2007
|
Application #:
|
11019912
|
Filing Dt:
|
12/21/2004
|
Publication #:
|
|
Pub Dt:
|
06/22/2006
| | | | |
Title:
|
PROCESS FOR FORMING MEMS
|
|
|
Patent #:
|
|
Issue Dt:
|
09/18/2007
|
Application #:
|
11102982
|
Filing Dt:
|
04/11/2005
|
Publication #:
|
|
Pub Dt:
|
06/22/2006
| | | | |
Title:
|
PROCESS FOR FORMING MICROSTRUCTURES
|
|
|
Patent #:
|
|
Issue Dt:
|
07/17/2007
|
Application #:
|
11194720
|
Filing Dt:
|
08/01/2005
|
Publication #:
|
|
Pub Dt:
|
02/01/2007
| | | | |
Title:
|
POST AND TIP DESIGN FOR A PROBE CONTACT
|
|
|
Patent #:
|
|
Issue Dt:
|
04/22/2008
|
Application #:
|
11194801
|
Filing Dt:
|
08/01/2005
|
Publication #:
|
|
Pub Dt:
|
02/01/2007
| | | | |
Title:
|
TORSION SPRING PROBE CONTACTOR DESIGN
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
11226568
|
Filing Dt:
|
09/14/2005
|
Publication #:
|
|
Pub Dt:
|
03/15/2007
| | | | |
Title:
|
Lateral interposer contact design and probe card assembly
|
|
|
Patent #:
|
|
Issue Dt:
|
04/29/2008
|
Application #:
|
11317408
|
Filing Dt:
|
12/22/2005
|
Publication #:
|
|
Pub Dt:
|
06/28/2007
| | | | |
Title:
|
PROBE CARD ASSEMBLY
|
|
|
Patent #:
|
|
Issue Dt:
|
02/20/2007
|
Application #:
|
11346954
|
Filing Dt:
|
02/03/2006
|
Title:
|
PROBE HEAD WITH MACHINED MOUNTING PADS AND METHOD OF FORMING SAME
|
|
|
Patent #:
|
|
Issue Dt:
|
04/08/2008
|
Application #:
|
11369343
|
Filing Dt:
|
03/06/2006
|
Publication #:
|
|
Pub Dt:
|
03/22/2007
| | | | |
Title:
|
OPTICALLY ENHANCED PROBE ALIGNMENT
|
|
|
Patent #:
|
|
Issue Dt:
|
05/27/2008
|
Application #:
|
11421064
|
Filing Dt:
|
05/30/2006
|
Publication #:
|
|
Pub Dt:
|
12/06/2007
| | | | |
Title:
|
STACKED CONTACT BUMP
|
|
|
Patent #:
|
|
Issue Dt:
|
05/26/2009
|
Application #:
|
11457132
|
Filing Dt:
|
07/12/2006
|
Publication #:
|
|
Pub Dt:
|
01/17/2008
| | | | |
Title:
|
PROBE CARD WITH BALANCED LATERAL FORCE
|
|
|
Patent #:
|
|
Issue Dt:
|
04/29/2008
|
Application #:
|
11535219
|
Filing Dt:
|
09/26/2006
|
Publication #:
|
|
Pub Dt:
|
09/06/2007
| | | | |
Title:
|
EXCESS OVERDRIVE DETECTOR FOR PROBE CARDS
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
11633324
|
Filing Dt:
|
12/04/2006
|
Publication #:
|
|
Pub Dt:
|
04/05/2007
| | | | |
Title:
|
Lateral interposer contact design and probe card assembly
|
|
|
Patent #:
|
|
Issue Dt:
|
07/31/2012
|
Application #:
|
11641255
|
Filing Dt:
|
12/19/2006
|
Publication #:
|
|
Pub Dt:
|
08/09/2007
| | | | |
Title:
|
PROBE HEAD WITH MACHINE MOUNTING PADS AND METHOD OF FORMING SAME
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
11686768
|
Filing Dt:
|
03/15/2007
|
Publication #:
|
|
Pub Dt:
|
09/18/2008
| | | | |
Title:
|
SYSTEM TO OPTIMIZE A SEMICONDUCTOR PROBE CARD
|
|
|
Patent #:
|
|
Issue Dt:
|
09/15/2009
|
Application #:
|
11734434
|
Filing Dt:
|
04/12/2007
|
Publication #:
|
|
Pub Dt:
|
10/16/2008
| | | | |
Title:
|
HYBRID PROBE FOR TESTING SEMICONDUCTOR DEVICES
|
|
|
Patent #:
|
|
Issue Dt:
|
07/20/2010
|
Application #:
|
11754818
|
Filing Dt:
|
05/29/2007
|
Publication #:
|
|
Pub Dt:
|
12/04/2008
| | | | |
Title:
|
SEMICODUCTOR TESTING DEVICE WITH ELASTOMER INTERPOSER
|
|
|
Patent #:
|
|
Issue Dt:
|
07/27/2010
|
Application #:
|
11778207
|
Filing Dt:
|
07/16/2007
|
Publication #:
|
|
Pub Dt:
|
01/22/2009
| | | | |
Title:
|
METHOD FOR REPARING A MICROELECTROMECHANICAL SYSTEM
|
|
|
Patent #:
|
|
Issue Dt:
|
04/12/2011
|
Application #:
|
11796482
|
Filing Dt:
|
04/27/2007
|
Publication #:
|
|
Pub Dt:
|
10/18/2007
| | | | |
Title:
|
POST AND TIP DESIGN FOR A PROBE CONTACT
|
|
|
Patent #:
|
|
Issue Dt:
|
09/15/2009
|
Application #:
|
11855094
|
Filing Dt:
|
09/13/2007
|
Publication #:
|
|
Pub Dt:
|
03/19/2009
| | | | |
Title:
|
FORKED PROBE FOR TESTING SEMICONDUCTOR DEVICES
|
|
|
Patent #:
|
|
Issue Dt:
|
07/20/2010
|
Application #:
|
11901014
|
Filing Dt:
|
09/14/2007
|
Publication #:
|
|
Pub Dt:
|
01/10/2008
| | | | |
Title:
|
METHOD OF FORMING PROBE CARD ASSEMBLY
|
|
|
Patent #:
|
|
Issue Dt:
|
09/07/2010
|
Application #:
|
11953204
|
Filing Dt:
|
12/10/2007
|
Publication #:
|
|
Pub Dt:
|
06/11/2009
| | | | |
Title:
|
PLANARIZING PROBE CARD
|
|
|
Patent #:
|
|
Issue Dt:
|
05/25/2010
|
Application #:
|
11983521
|
Filing Dt:
|
11/09/2007
|
Publication #:
|
|
Pub Dt:
|
05/08/2008
| | | | |
Title:
|
TORSION SPRING PROBE CONTACTOR DESIGN
|
|
|
Patent #:
|
|
Issue Dt:
|
06/01/2010
|
Application #:
|
11986453
|
Filing Dt:
|
11/21/2007
|
Publication #:
|
|
Pub Dt:
|
09/04/2008
| | | | |
Title:
|
PROBE CARD ASSEMBLY AND METHOD OF FORMING SAME
|
|
|
Patent #:
|
|
Issue Dt:
|
08/10/2010
|
Application #:
|
12042295
|
Filing Dt:
|
03/04/2008
|
Publication #:
|
|
Pub Dt:
|
10/16/2008
| | | | |
Title:
|
PROBE FOR TESTING SEMICONDUCTOR DEVICES WITH FEATURES THAT INCREASE STRESS TOLERANCE
|
|
|
Patent #:
|
|
Issue Dt:
|
04/06/2010
|
Application #:
|
12077627
|
Filing Dt:
|
03/20/2008
|
Publication #:
|
|
Pub Dt:
|
09/24/2009
| | | | |
Title:
|
PROBE CARD SUBSTRATE WITH BONDED VIA
|
|