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Patent Assignment Details
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Reel/Frame:021631/0916   Pages: 6
Recorded: 10/03/2008
Attorney Dkt #:LEE.045, LEE.047
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 2
1
Patent #:
Issue Dt:
03/31/2009
Application #:
11258085
Filing Dt:
10/26/2005
Publication #:
Pub Dt:
05/04/2006
Title:
MULTI-ROW SUBSTRATE STRIP AND METHOD FOR MANUFACTURING THE SAME
2
Patent #:
NONE
Issue Dt:
Application #:
11264000
Filing Dt:
11/02/2005
Publication #:
Pub Dt:
05/04/2006
Title:
Circuitized substrate with trace embedded inside ground layer
Assignor
1
Exec Dt:
09/02/2008
Assignee
1
2300 KIN KE ROAD
ZHANGJIANG HI-TECH PARK
SHANGHAI, CHINA P.R.C.
Correspondence name and address
ANDREW J. TELESZ, JR.
VOLENTINE & WHITT, P.L.L.C.
11951 FREEDOM DRIVE, SUITE 1260
RESTON, VA 20190

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