Patent Assignment Details
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Reel/Frame: | 042287/0917 | |
| Pages: | 5 |
| | Recorded: | 05/09/2017 | | |
Attorney Dkt #: | 68293-565001US |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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07/23/2019
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Application #:
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15590111
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Filing Dt:
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05/09/2017
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Publication #:
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Pub Dt:
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09/20/2018
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Title:
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SUBSTRATE CONSTRUCTION AND ELECTRONIC PACKAGE INCLUDING THE SAME
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Assignee
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NO. 123, SEC. 3, DAFENG RD. |
TAICHUNG CITY, TAIWAN 427 |
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Correspondence name and address
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MINTZ LEVIN
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ONE FINANCIAL CENTER
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BOSTON, MA 02111
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09/25/2024 01:55 PM
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