Patent Assignment Details
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Reel/Frame: | 018053/0918 | |
| Pages: | 4 |
| | Recorded: | 08/02/2006 | | |
Attorney Dkt #: | P2613US |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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02/24/2009
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Application #:
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11474632
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Filing Dt:
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06/26/2006
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Publication #:
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Pub Dt:
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05/31/2007
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Title:
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HEAD ASSEMBLY FOR CHIP MOUNTER
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Assignee
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28 SUNGJU-DONG |
CHANGWON-CITY, KYONGSANGNAM-DO, KOREA, REPUBLIC OF |
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Correspondence name and address
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BRIAN C. RUPP
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GARDNER CARTON & DOUGLAS LLP
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191 N. WACKER DRIVE, SUITE 3700
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CHICAGO, ILLINOIS 60606-1698
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