Patent Assignment Details
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| Reel/Frame: | 063874/0918 | |
| Pages: | 9 |
| | Recorded: | 06/07/2023 | | |
| Attorney Dkt #: | ONS01687DCPCC01US |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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05/14/2024
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Application #:
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18330133
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Filing Dt:
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06/06/2023
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Publication #:
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Pub Dt:
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10/05/2023
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Title:
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SEMICONDUCTOR PACKAGE STRUCTURES AND METHODS OF MANUFACTURE
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Assignee
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| 5701 N. PIMA ROAD |
| SCOTTSDALE, ARIZONA 85250 |
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Correspondence name and address
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SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
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5701 N. PIMA ROAD
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SCOTTSDALE, AZ 85250
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05/28/2024 06:39 AM
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