Patent Assignment Details
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| Reel/Frame: | 017836/0922 | |
| Pages: | 3 |
| | Recorded: | 04/28/2006 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11413162
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Filing Dt:
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04/28/2006
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Publication #:
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Pub Dt:
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06/28/2007
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Title:
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Method for fabricating semiconductor device having top round recess pattern
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Assignee
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| SAN 136-1, AMI-RI, BUBAL-EUB, ICHON-SHI |
| KYOUNGKI-DO 467-860, KOREA, REPUBLIC OF |
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Correspondence name and address
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MR. ERNEST F. CHAPMAN
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FINNEGAN, HENDERSON, FARABOW, ET AL
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901 NEW YORK AVENUE, NW
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WASHINGTON, D.C. 20001-4413
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