Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
| Reel/Frame: | 055213/0924 | |
| Pages: | 4 |
| | Recorded: | 02/04/2021 | | |
| Attorney Dkt #: | PN148336HTKS |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
|
|
Total properties:
8
|
|
|
|
Patent #:
|
|
Issue Dt:
|
09/07/2010
|
Application #:
|
12163581
|
Filing Dt:
|
06/27/2008
|
|
Publication #:
|
|
Pub Dt:
|
12/04/2008
| | | | |
|
Title:
|
SEMICONDUCTOR DEVICE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
01/04/2011
|
Application #:
|
12848652
|
Filing Dt:
|
08/02/2010
|
|
Publication #:
|
|
Pub Dt:
|
11/25/2010
| | | | |
|
Title:
|
WAFER LEVEL CHIP SCALE PACKAGE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
06/17/2014
|
Application #:
|
13397876
|
Filing Dt:
|
02/16/2012
|
|
Publication #:
|
|
Pub Dt:
|
06/14/2012
| | | | |
|
Title:
|
WAFER-LEVEL INTERCONNECT FOR HIGH MECHANICAL RELIABILITY APPLICATIONS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
05/21/2013
|
Application #:
|
13457311
|
Filing Dt:
|
04/26/2012
|
|
Publication #:
|
|
Pub Dt:
|
09/13/2012
| | | | |
|
Title:
|
SOLDER BUMP INTERCONNECT
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
04/28/2015
|
Application #:
|
13572376
|
Filing Dt:
|
08/10/2012
|
|
Publication #:
|
|
Pub Dt:
|
02/14/2013
| | | | |
|
Title:
|
THIN FILM STRUCTURE FOR HIGH DENSITY INDUCTORS AND REDISTRIBUTION IN WAFER LEVEL PACKAGING
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
03/17/2015
|
Application #:
|
13789411
|
Filing Dt:
|
03/07/2013
|
|
Publication #:
|
|
Pub Dt:
|
12/12/2013
| | | | |
|
Title:
|
METHOD FOR APPLYING A FINAL METAL LAYER FOR WAFER LEVEL PACKAGING AND ASSOCIATED DEVICE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
04/18/2017
|
Application #:
|
13826987
|
Filing Dt:
|
03/14/2013
|
|
Publication #:
|
|
Pub Dt:
|
08/01/2013
| | | | |
|
Title:
|
METHOD FOR BUILDING VERTICAL PILLAR INTERCONNECT
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
06/30/2015
|
Application #:
|
14039384
|
Filing Dt:
|
09/27/2013
|
|
Publication #:
|
|
Pub Dt:
|
01/01/2015
| | | | |
|
Title:
|
ELECTROPLATING USING DIELECTRIC BRIDGES
|
|
|
Assignee
|
|
|
|
|
| 112 LONGTENG ROAD, ECONOMIC & TECHNICAL DEVELOPMENT ZONE |
| KUNSHAN, JIANGSU, CHINA 215300 |
|
|
Correspondence name and address
|
| |
GANG YU
|
| |
ACIP INTERNATIONAL, INC. 419 10TH ST,
|
| |
SF, CA 94103
|
Search Results as of:
05/29/2024 04:55 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
