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Total properties:
14
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Patent #:
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Issue Dt:
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05/02/2017
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Application #:
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14465264
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Filing Dt:
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08/21/2014
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Publication #:
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Pub Dt:
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12/11/2014
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Title:
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Power Modules and Power Module Arrays Having A Modular Design
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Patent #:
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Issue Dt:
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08/27/2019
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Application #:
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15919889
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Filing Dt:
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03/13/2018
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Publication #:
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Pub Dt:
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09/19/2019
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Title:
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METHOD OF ETCHING MICROELECTRONIC MECHANICAL SYSTEM FEATURES IN A SILICON WAFER
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Patent #:
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Issue Dt:
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12/08/2020
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Application #:
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16164286
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Filing Dt:
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10/18/2018
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Publication #:
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Pub Dt:
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04/23/2020
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Title:
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ELECTRONIC ASSEMBLIES HAVING A MESH BOND MATERIAL AND METHODS OF FORMING THEREOF
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Patent #:
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Issue Dt:
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01/26/2021
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Application #:
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16165563
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Filing Dt:
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10/19/2018
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Publication #:
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Pub Dt:
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04/23/2020
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Title:
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POWER ELECTRONIC ASSEMBLIES WITH SOLDER LAYER AND EXTERIOR COATING, AND METHODS OF FORMING THE SAME
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Patent #:
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Issue Dt:
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06/30/2020
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Application #:
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16165635
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Filing Dt:
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10/19/2018
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Publication #:
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Pub Dt:
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04/23/2020
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Title:
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ENCAPSULATED STRESS MITIGATION LAYER AND POWER ELECTRONIC ASSEMBLIES INCORPORATING THE SAME
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Patent #:
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Issue Dt:
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10/13/2020
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Application #:
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16170432
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Filing Dt:
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10/25/2018
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Publication #:
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Pub Dt:
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04/30/2020
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Title:
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POWER ELECTRONIC ASSEMBLIES WITH HIGH PURITY ALUMINUM PLATED SUBSTRATES
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Patent #:
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Issue Dt:
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07/20/2021
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Application #:
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16170956
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Filing Dt:
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10/25/2018
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Publication #:
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Pub Dt:
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04/30/2020
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Title:
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THERMAL COMPENSATION LAYERS WITH CORE-SHELL PHASE CHANGE PARTICLES AND POWER ELECTRONICS ASSEMBLIES INCORPORATING THE SAME
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Patent #:
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Issue Dt:
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03/16/2021
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Application #:
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16170974
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Filing Dt:
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10/25/2018
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Publication #:
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Pub Dt:
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04/30/2020
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Title:
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VAPOR CHAMBER HEAT SPREADERS HAVING IMPROVED TRANSIENT THERMAL RESPONSE AND METHODS OF MAKING THE SAME
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Patent #:
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Issue Dt:
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01/19/2021
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Application #:
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16189502
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Filing Dt:
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11/13/2018
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Publication #:
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Pub Dt:
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05/14/2020
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Title:
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POWER ELECTRONICS MODULES INCLUDING AN INTEGRATED COOLING CHANNEL EXTENDING THROUGH AN ELECTRICALLY-CONDUCTIVE SUBSTRATE
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Patent #:
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Issue Dt:
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08/11/2020
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Application #:
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16215898
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Filing Dt:
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12/11/2018
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Publication #:
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Pub Dt:
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06/11/2020
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Title:
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COOLING DEVICES INCLUDING JET COOLING WITH AN INTERMEDIATE MESH AND METHODS FOR USING THE SAME
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Patent #:
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Issue Dt:
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06/09/2020
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Application #:
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16243625
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Filing Dt:
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01/09/2019
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Title:
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ENCAPSULATED PHASE CHANGE POROUS LAYER
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Patent #:
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Issue Dt:
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01/12/2021
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Application #:
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16250743
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Filing Dt:
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01/17/2019
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Publication #:
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Pub Dt:
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07/23/2020
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Title:
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METHODS OF FORMING POWER ELECTRONIC ASSEMBLIES USING METAL INVERSE OPAL STRUCTURES AND ENCAPSULATED-POLYMER SPHERES
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Patent #:
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Issue Dt:
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05/04/2021
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Application #:
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16508820
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Filing Dt:
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07/11/2019
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Publication #:
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Pub Dt:
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01/14/2021
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Title:
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FLEXIBLE ELECTRONIC ASSEMBLY FOR PLACEMENT ON A VEHICLE MOTOR ASSEMBLY
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Patent #:
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Issue Dt:
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05/11/2021
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Application #:
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16508842
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Filing Dt:
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07/11/2019
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Publication #:
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Pub Dt:
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01/14/2021
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Title:
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METAL INVERSE OPAL SUBSTRATE WITH INTEGRATED JET COOLING IN ELECTRONIC MODULES
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