Patent Assignment Details
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Reel/Frame: | 021927/0925 | |
| Pages: | 3 |
| | Recorded: | 12/04/2008 | | |
Attorney Dkt #: | 01159_1006 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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12/28/2010
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Application #:
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12298706
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Filing Dt:
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12/02/2008
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Publication #:
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Pub Dt:
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09/03/2009
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Title:
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SOLDER RESIST MATERIAL, WIRING BOARD USING THE SOLDER RESIST MATERIAL, AND SEMICONDUCTOR PACKAGE
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Assignee
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5-8, HIGASHI-SHINAGAWA 2-CHOME, SHINAGAWA-KU |
TOKYO, JAPAN 140-0002 |
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Correspondence name and address
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MASAYASU MORI
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918 PRINCE STREET
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ALEXANDRIA, VA 22314
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