Patent Assignment Details
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Reel/Frame: | 014521/0926 | |
| Pages: | 2 |
| | Recorded: | 09/22/2003 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10157823
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Filing Dt:
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05/31/2002
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Publication #:
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Pub Dt:
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01/09/2003
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Title:
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MANUFACTURING METHOD OF A BLOCK MOLDING SEMICONDUCTOR DEVICE DIVIDED BY DICING BLADE
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Assignees
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6, KANDA SURUGADAI 4-CHOME |
CHIYODA-KU |
TOKYO, JAPAN |
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145, AZANAKAJIMA, NANAECHO |
KAMEDA-GUN, HOKKAIDO, JAPAN |
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Correspondence name and address
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MATTINGLY, STANGER & MALUR, P.C.
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JOHN R. MATTINGLY
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18700 DIAGONAL ROAD, SUITE 370
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ALEXANDRIA, VA 22314
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