|
Total properties:
12
|
|
|
|
Patent #:
|
|
Issue Dt:
|
12/27/1994
|
Application #:
|
07769892
|
Filing Dt:
|
10/01/1991
|
|
Title:
|
ELECTRICALLY CONDUCTIVE COMPOSITIONS AND METHODS FOR THE PREPARATION AND USE THEREOF
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
07/23/1996
|
Application #:
|
08188658
|
Filing Dt:
|
01/26/1994
|
|
Title:
|
COMPOSITE SUBSTRATES FOR PREPARATION OF PRINTED CIRCUITS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
11/03/1998
|
Application #:
|
08324060
|
Filing Dt:
|
10/17/1994
|
|
Title:
|
ELECTRICALLY CONDUCTIVE COMPOSITIONS AND METHODS FOR THE PREPARATION AND USE THEREOF
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
10/15/1996
|
Application #:
|
08478453
|
Filing Dt:
|
06/07/1995
|
|
Title:
|
COMPOSITE SUBSTRATES FOR PREPARATION OF PRINTED CIRCUITS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
02/10/1998
|
Application #:
|
08483079
|
Filing Dt:
|
06/07/1995
|
|
Title:
|
MULTILAYER PRINTED CIRCUIT
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
12/29/1998
|
Application #:
|
08704467
|
Filing Dt:
|
08/28/1996
|
|
Title:
|
TRANSIENT LIQUID PHASE SINTERING CONDUCTIVE ADHESIVES
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
09/07/1999
|
Application #:
|
08813809
|
Filing Dt:
|
03/06/1997
|
|
Title:
|
VERTICALLY INTERCONNECTED ELECTRONIC ASSEMBLIES AND COMPOSITIONS USEFUL THEREFOR
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
07/13/1999
|
Application #:
|
08816401
|
Filing Dt:
|
03/03/1997
|
|
Title:
|
METAL-PLATING OF CURED AND SINTERED TRANSIENT LIQUID PHASE SINTERING PASTES
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
11/09/1999
|
Application #:
|
08942368
|
Filing Dt:
|
10/02/1997
|
|
Title:
|
NOVEL METAL-CONTAINING COMPOSITIONS AND USES THEREOF, INCLUDING PREPARATION OF RESISTOR AND THERMISTOR ELEMENTS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
05/30/2000
|
Application #:
|
09021967
|
Filing Dt:
|
02/11/1998
|
|
Title:
|
INDIVIDUAL EMBEDDED CAPACITORS FOR LAMINATED PRINTED CIRCUIT BOARDS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
10/03/2000
|
Application #:
|
09093966
|
Filing Dt:
|
06/08/1998
|
|
Title:
|
PROCESS FOR PRODUCING HIGH PERFORMANCE THERMOELECTRIC MODULES
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
07/11/2000
|
Application #:
|
09123563
|
Filing Dt:
|
07/27/1998
|
|
Title:
|
METHODS TO PRODUCE INSULATED CONDUCTIVE THROUGH-FEATURES IN CONDUCTIVE CORE MATERIALS FOR ELECTRONIC PACKAGING
|
|
