Patent Assignment Details
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Reel/Frame: | 019963/0927 | |
| Pages: | 11 |
| | Recorded: | 10/15/2007 | | |
Attorney Dkt #: | 220832-1 (113) |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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10/20/2009
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Application #:
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11872562
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Filing Dt:
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10/15/2007
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Publication #:
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Pub Dt:
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04/16/2009
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Title:
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SEALED WAFER PACKAGING OF MICROELECTROMECHANICAL SYSTEMS
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Assignee
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1 RIVER ROAD |
SCHENECTADY, NEW YORK 12345 |
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Correspondence name and address
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JASON K. KLINDTWORTH
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GENERAL ELECTRIC COMPANY
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1 RESEARCH CIRCLE, K1-3A65
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NISKAYUNA, NY 12309
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