Total properties:
39
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Patent #:
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Issue Dt:
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01/27/1998
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Application #:
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08631580
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Filing Dt:
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04/12/1996
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Title:
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AIR-DIELECTRIC STRIPLINE
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Patent #:
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Issue Dt:
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11/25/2003
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Application #:
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09707033
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Filing Dt:
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11/06/2000
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Title:
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PROCESS FOR MANUFACTURE OF PRINTED CIRCUIT BOARDS WITH THICK COPPER POWER CIRCUITRY AND THIN COPPER SIGNAL CIRCUITRY ON THE SAME LAYER
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Patent #:
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Issue Dt:
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06/17/2003
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Application #:
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09711366
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Filing Dt:
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11/10/2000
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Title:
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SYSTEM AND METHOD FOR MONITORING AND IMPROVING DIMENSIONAL STABILITY AND REGISTRATION ACCURACY OF MULTI-LAYER PCB MANUFACTURE
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Patent #:
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Issue Dt:
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02/17/2004
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Application #:
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09992810
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Filing Dt:
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11/19/2001
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Publication #:
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Pub Dt:
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10/03/2002
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Title:
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PCB EMBEDDED AND SURFACE MOUNTED OPTICAL DISTRIBUTION SYSTEMS
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Patent #:
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Issue Dt:
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02/01/2005
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Application #:
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10051418
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Filing Dt:
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10/30/2001
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Publication #:
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Pub Dt:
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11/28/2002
| | | | |
Title:
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FIBER OPTIC CIRCUIT BOARD CONNECTOR
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Patent #:
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Issue Dt:
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07/15/2003
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Application #:
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10179756
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Filing Dt:
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06/25/2002
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Publication #:
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Pub Dt:
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12/26/2002
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Title:
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BENDING AN OPTICAL FIBER INTO A BACKPLANE
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Patent #:
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Issue Dt:
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12/21/2004
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Application #:
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10179758
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Filing Dt:
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06/25/2002
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Publication #:
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Pub Dt:
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01/09/2003
| | | | |
Title:
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SYSTEM AND METHOD FOR INTEGRATING OPTICAL LAYERS IN A PCB FOR INTER-BOARD COMMUNICATIONS
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Patent #:
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Issue Dt:
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11/16/2004
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Application #:
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10273820
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Filing Dt:
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10/18/2002
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Publication #:
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Pub Dt:
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10/23/2003
| | | | |
Title:
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SYSTEM AND METHOD FOR ELECTROLYTIC PLATING
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Patent #:
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Issue Dt:
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06/22/2010
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Application #:
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10555899
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Filing Dt:
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12/04/2006
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Publication #:
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Pub Dt:
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11/29/2007
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Title:
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MICROELECTRONIC SUBSTRATES WITH THERMALLY CONDUCTIVE PATHWAYS AND METHODS OF MAKING SAME
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Patent #:
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Issue Dt:
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07/03/2007
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Application #:
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10609068
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Filing Dt:
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06/27/2003
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Publication #:
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Pub Dt:
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01/13/2005
| | | | |
Title:
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METHOD FOR ANALYZING MATERIAL DENSITY VARIATIONS ON A MULTI-LAYER PRINTED CIRCUIT BOARD
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Patent #:
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Issue Dt:
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08/24/2004
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Application #:
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10618786
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Filing Dt:
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07/14/2003
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Publication #:
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Pub Dt:
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01/15/2004
| | | | |
Title:
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BENDING AN OPTICAL FIBER INTO BACKPLANE
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Patent #:
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Issue Dt:
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12/20/2005
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Application #:
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10825980
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Filing Dt:
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04/16/2004
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Publication #:
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Pub Dt:
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10/07/2004
| | | | |
Title:
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FIBER OPTIC CIRCUIT CONNECTOR
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Patent #:
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Issue Dt:
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04/04/2006
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Application #:
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11016146
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Filing Dt:
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12/17/2004
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Publication #:
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Pub Dt:
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06/16/2005
| | | | |
Title:
|
SYSTEM AND METHOD FOR INTEGRATING OPTICAL LAYERS IN A PCB FOR INTER-BOARD COMMUNICATIONS
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Patent #:
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Issue Dt:
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02/20/2007
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Application #:
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11311616
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Filing Dt:
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12/19/2005
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Publication #:
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Pub Dt:
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05/11/2006
| | | | |
Title:
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FIBER OPTIC CIRCUIT CONNECTOR
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|
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Patent #:
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Issue Dt:
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04/29/2008
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Application #:
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11345858
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Filing Dt:
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02/01/2006
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Publication #:
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Pub Dt:
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09/28/2006
| | | | |
Title:
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CIRCUIT BOARD ASSEMBLY HAVING A GUIDE INSERT
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Patent #:
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Issue Dt:
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08/22/2006
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Application #:
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11348923
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Filing Dt:
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02/06/2006
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Publication #:
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Pub Dt:
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06/22/2006
| | | | |
Title:
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BENDING AN OPTICAL FIBER INTO A BACKPLANE
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Patent #:
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Issue Dt:
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01/08/2008
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Application #:
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11500106
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Filing Dt:
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08/07/2006
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Publication #:
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Pub Dt:
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11/30/2006
| | | | |
Title:
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INDOOR-OUTDOOR EQUIPMENT ENCLOSURE AND METHOD FOR ASSEMBLING THE SAME
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Patent #:
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Issue Dt:
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03/06/2007
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Application #:
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11501613
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Filing Dt:
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08/09/2006
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Publication #:
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Pub Dt:
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12/07/2006
| | | | |
Title:
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BENDING AN OPTICAL FIBER INTO A BACKPLANE
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Patent #:
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Issue Dt:
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04/28/2009
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Application #:
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11706473
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Filing Dt:
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02/14/2007
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Publication #:
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Pub Dt:
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10/25/2007
| | | | |
Title:
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METHODS OF MANUFACTURING PRINTED CIRCUIT BOARDS WITH STACKED MICRO VIAS
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Patent #:
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|
Issue Dt:
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09/23/2008
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Application #:
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11714756
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Filing Dt:
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03/06/2007
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Publication #:
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Pub Dt:
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07/05/2007
| | | | |
Title:
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BENDING AN OPTICAL FIBER INTO A BACKPLANE
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Patent #:
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|
Issue Dt:
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08/28/2012
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Application #:
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12070811
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Filing Dt:
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02/20/2008
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Publication #:
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Pub Dt:
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08/21/2008
| | | | |
Title:
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METHOD OF MANUFACTURING A PRINTED CIRCUIT BOARD
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Patent #:
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Issue Dt:
|
04/17/2012
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Application #:
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12157021
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Filing Dt:
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06/05/2008
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Publication #:
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Pub Dt:
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12/11/2008
| | | | |
Title:
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METHOD OF MANUFACTURING A MULTILAYER PRINTED WIRING BOARD WITH COPPER WRAP PLATED HOLE
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Patent #:
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Issue Dt:
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12/28/2010
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Application #:
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12381925
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Filing Dt:
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03/17/2009
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Publication #:
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Pub Dt:
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07/16/2009
| | | | |
Title:
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METHODS OF MANUFACTURING PRINTED CIRCUIT BOARDS WITH STACKED MICRO VIAS
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|
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Patent #:
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|
Issue Dt:
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02/28/2012
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Application #:
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12494235
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Filing Dt:
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06/29/2009
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Publication #:
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Pub Dt:
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12/30/2010
| | | | |
Title:
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SYSTEM FOR FILLING HOLES IN A PRINTED CIRCUIT BOARD WITH A FLUID FILL MATERIAL
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|
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Patent #:
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|
Issue Dt:
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05/21/2013
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Application #:
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12494240
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Filing Dt:
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06/29/2009
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Publication #:
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Pub Dt:
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12/30/2010
| | | | |
Title:
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SYSTEM FOR CLEANING COMPONENTS FOR FILLING HOLES IN A PRINTED CIRCUIT BOARD WITH A FLUID FILL MATERIAL
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Patent #:
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Issue Dt:
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06/04/2013
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Application #:
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12539172
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Filing Dt:
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08/11/2009
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Publication #:
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Pub Dt:
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02/18/2010
| | | | |
Title:
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MANUFACTURING METHODS OF MULTILAYER PRINTED CIRCUIT BOARD HAVING STACKED VIA
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Patent #:
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|
Issue Dt:
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09/20/2011
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Application #:
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12772086
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Filing Dt:
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04/30/2010
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Title:
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METHODS OF MANUFACTURING PRINTED CIRCUIT BOARDS
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Patent #:
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|
Issue Dt:
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02/10/2015
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Application #:
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12938265
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Filing Dt:
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11/02/2010
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Publication #:
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Pub Dt:
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02/24/2011
| | | | |
Title:
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METHODS OF MANUFACTURING PRINTED CIRCUIT BOARDS WITH STACKED MICRO VIAS
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Patent #:
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Issue Dt:
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10/29/2013
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Application #:
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13153254
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Filing Dt:
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06/03/2011
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Publication #:
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Pub Dt:
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01/05/2012
| | | | |
Title:
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METHODS OF MANUFACTURING PRINTED CIRCUIT BOARDS
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Patent #:
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Issue Dt:
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04/28/2015
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Application #:
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13162408
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Filing Dt:
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06/16/2011
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Publication #:
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Pub Dt:
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12/22/2011
| | | | |
Title:
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SYSTEMS AND METHODS FOR REDUCING OVERHANG ON ELECTROPLATED SURFACES OF PRINTED CIRCUIT BOARDS
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Patent #:
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Issue Dt:
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10/21/2014
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Application #:
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13206414
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Filing Dt:
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08/09/2011
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Publication #:
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Pub Dt:
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12/01/2011
| | | | |
Title:
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METHODS OF MANUFACTURING PRINTED CIRCUIT BOARDS USING PARALLEL PROCESSES TO INTERCONNECT WITH SUBASSEMBLIES
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Patent #:
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Issue Dt:
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08/20/2013
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Application #:
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13399995
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Filing Dt:
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02/17/2012
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Publication #:
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Pub Dt:
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06/14/2012
| | | | |
Title:
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METHODS OF MANUFACTURING A PRINTED WIRING BOARD HAVING COPPER WRAP PLATED HOLE
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Patent #:
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Issue Dt:
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04/21/2015
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Application #:
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13482702
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Filing Dt:
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05/29/2012
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Publication #:
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Pub Dt:
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07/18/2013
| | | | |
Title:
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PRINTED CIRCUIT BOARD WITH EMBEDDED HEATER
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Patent #:
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Issue Dt:
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12/20/2016
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Application #:
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13537361
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Filing Dt:
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06/29/2012
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Publication #:
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Pub Dt:
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01/02/2014
| | | | |
Title:
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CIRCUIT BOARD MULTI-FUNCTIONAL HOLE SYSTEM AND METHOD
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Patent #:
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NONE
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Issue Dt:
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Application #:
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13594971
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Filing Dt:
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08/27/2012
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Publication #:
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Pub Dt:
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08/29/2013
| | | | |
Title:
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METHOD OF MANUFACTURING A PRINTED CIRCUIT BOARD
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Patent #:
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Issue Dt:
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12/27/2016
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Application #:
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13852947
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Filing Dt:
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03/28/2013
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Publication #:
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Pub Dt:
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10/17/2013
| | | | |
Title:
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METHOD OF FABRICATING A PRINTED CIRCUIT BOARD INTERCONNECT ASSEMBLY
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Patent #:
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Issue Dt:
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08/15/2017
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Application #:
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14065047
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Filing Dt:
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10/28/2013
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Publication #:
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Pub Dt:
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02/20/2014
| | | | |
Title:
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SYSTEMS AND METHODS OF MANUFACTURING PRINTED CIRCUIT BOARDS USING BLIND AND INTERNAL MICRO VIAS TO COUPLE SUBASSEMBLIES
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Patent #:
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Issue Dt:
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11/01/2016
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Application #:
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14518434
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Filing Dt:
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10/20/2014
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Publication #:
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Pub Dt:
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02/12/2015
| | | | |
Title:
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METHODS OF MANUFACTURING PRINTED CIRCUIT BOARDS WITH STACKED MICRO VIAS
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Patent #:
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Issue Dt:
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03/06/2018
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Application #:
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14694756
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Filing Dt:
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04/23/2015
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Publication #:
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Pub Dt:
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10/27/2016
| | | | |
Title:
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METHOD FOR ANCHORING A CONDUCTIVE CAP ON A FILLED VIA IN A PRINTED CIRCUIT BOARD AND PRINTED CIRCUIT BOARD WITH AN ANCHORED CONDUCTIVE CAP
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|