Patent Assignment Details
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| Reel/Frame: | 046665/0928 | |
| Pages: | 3 |
| | Recorded: | 08/22/2018 | | |
| Attorney Dkt #: | IFIS066-US-DIV |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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04/28/2020
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Application #:
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16106239
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Filing Dt:
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08/21/2018
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Publication #:
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Pub Dt:
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02/27/2020
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Title:
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METHODS OF FORMING INTEGRATED CIRCUIT STRUCTURE FOR JOINING WAFERS AND RESULTING STRUCTURE
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Assignee
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| P.O. BOX 309 |
| UGLAND HOUSE |
| GRAND CAYMAN, CAYMAN ISLANDS KY1-1104 |
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Correspondence name and address
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HOFFMAN WARNICK LLC
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540 BROADWAY
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ALBANY, NY 12207
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06/21/2024 10:48 AM
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