Patent Assignment Details
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| Reel/Frame: | 042249/0929 | |
| Pages: | 4 |
| | Recorded: | 05/05/2017 | | |
| Attorney Dkt #: | 67994-US-PA |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/21/2018
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Application #:
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15585166
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Filing Dt:
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05/03/2017
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Title:
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CHIP PACKAGE CIRCUIT BOARD MODULE
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Assignee
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| NO.38, XINGBANG RD., KWEI-SAN INDUSTRIAL ZONE |
| TAOYUAN CITY, TAIWAN 333 |
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Correspondence name and address
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JIANQ CHYUN INTELLECTUAL PROPERTY OFFICE
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7F.-1, NO. 100, ROOSEVELT RD., SEC. 2,
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TAIPEI, TAIWAN
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09/26/2024 09:12 AM
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