Patent Assignment Details
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Reel/Frame: | 016120/0930 | |
| Pages: | 9 |
| | Recorded: | 04/20/2005 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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07/01/2008
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Application #:
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10996148
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Filing Dt:
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11/23/2004
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Publication #:
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Pub Dt:
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05/25/2006
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Title:
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SEMICONDUCTOR PACKAGE INCLUDING DIE INTERPOSED BETWEEN CUP-SHAPED LEAD FRAME AND LEAD FRAME HAVING MESAS AND VALLEYS
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Assignee
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P.O. BOX 54951 |
SANTA CLARA, CALIFORNIA 95056-0951 |
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Correspondence name and address
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SILICON VALLEY PATENT GROUP LLP
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DAVID E. STEUBER
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2350 MISSION COLLEGE BLVD., SUITE 360
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SANTA CLARA, CA 95054
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